As the core driving force for the development of modern information technology, the technical level of the semiconductor industry's special equipment directly affects the independent and controllable capabilities of the industrial chain. In recent years, the global semiconductor equipment technology iteration speed has significantly accelerated, while domestic enterprises have continued to make breakthroughs in key equipment fields, and the process of domestic substitution has steadily advanced, providing important support for the security of the industrial chain.
1. Technology iteration promotes equipment upgrades
As semiconductor manufacturing processes move towards more advanced nodes, higher requirements are placed on the accuracy, efficiency and stability of special equipment. Equipment technology in key links such as lithography, etching, and thin film deposition continues to innovate. For example, the new generation of dry etching equipment has shown good performance in 5-nanometer and below processes, and some domestic equipment has passed verification and entered the production line testing stage. In addition, the intelligent level of measurement and detection equipment has been improved, combined with artificial intelligence algorithms, which further improves the yield control capability of wafer manufacturing.
2. The localization process has achieved phased results
Driven by policy support and market demand, domestic semiconductor equipment companies have increased their R&D investment and gradually broken the monopoly of foreign manufacturers. Taking etching equipment as an example, some domestic equipment has been delivered in batches and has been applied in logic chips, memory chips and other fields. In terms of thin film deposition equipment, domestic enterprises have successfully developed chemical vapor deposition equipment suitable for advanced processes through technical research, and its performance indicators are close to the international mainstream level. In addition, progress has been made in subdivided fields such as ion implantation and cleaning equipment, and some models have the conditions to replace imported equipment. The synergy effect of the upstream and downstream of the industrial chain has gradually emerged, and the cooperation between equipment manufacturers and wafer manufacturing companies has become closer, which has further accelerated the verification and optimization process of domestic equipment.
3. Future challenges and opportunities coexist
Although the technical level of domestic semiconductor equipment has been continuously improved, there is still a certain gap in areas such as high-end lithography machines. In the future, it is necessary to further strengthen basic research, break through key core technologies, optimize the industrial chain ecology, and improve the reliability and adaptability of equipment. With the adjustment of the global semiconductor industry pattern, domestic enterprises are expected to achieve greater breakthroughs in subdivided fields and contribute to the diversified development of the global supply chain. The localization substitution of semiconductor special equipment is a long-term project that requires continuous technical accumulation and market verification. Under the joint efforts of policy guidance, enterprise innovation and industrial collaboration, the domestic semiconductor equipment industry is expected to usher in a broader development space.
